AMAOE Stencil Mi3
Availability: In Stock
₹160
AMAOE Stencil Mi3 Specifications
Product Overview
- Model: AMAOE Stencil Mi3
- Type: Precision BGA Reballing Stencil
- Purpose: Tailored for accurate reballing of BGA (Ball Grid Array) components, offering precise alignment and reliable results in soldering applications.
- Material: High-quality stainless steel for superior durability and precision.
- Thickness: 0.12MM for accurate and reliable solder ball application.
- Dimensions: Compact design, easy to handle, and transport for use in professional repair settings.
- Heat Resistance: Engineered to withstand high temperatures required during soldering operations.
- Compatibility: Suitable for a variety of BGA chips used in electronics, providing flexibility for repair technicians.
Included Components
- Optional Frame Holder: Available with an optional alignment frame for precise positioning during reballing processes.
- Instruction Manual: Comes with an instructional guide to assist users with setup and optimal usage techniques.
Usage
- Target Audience: Designed for professional electronics repair technicians focused on reballing BGA components in smartphones, tablets, and other electronic devices.
- Ideal Applications: Useful in chip-level repairs requiring high precision, such as fixing motherboards and processors in mobile devices.
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AMAOE Stencil Mi5
Availability: In Stock
₹160
AMAOE Stencil Mi5 Specifications
Product Overview
- Model: AMAOE Stencil Mi5
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for high-accuracy reballing of BGA (Ball Grid Array) components in electronics repair, perfect for smartphones and small electronics.
- Material: High-quality stainless steel for long-lasting use and precision.
- Thickness: 0.12MM for optimal reballing performance and accuracy.
- Dimensions: Compact and lightweight, designed for easy handling in professional repair settings.
- Heat Resistance: Capable of withstanding high temperatures required during reballing and soldering.
- Compatibility: Best suited for BGA reballing of chips found in smartphones, tablets, and other small electronics, especially Mi series devices.
Included Components
- Optional Frame Holder: Available with an optional alignment frame for more precise solder ball positioning during use.
- Instruction Manual: Comes with a guide to help users with stencil setup and use.
Usage
- Target Audience: Ideal for professional repair technicians and DIY electronics enthusiasts working on chip-level repairs in smartphones, tablets, and other portable electronics.
- Ideal Applications: Especially suited for reballing BGA chips found in Mi series devices, ensuring precise and efficient repairs.
- New
AMAOE Stencil Mi4
Availability: In Stock
₹160
AMAOE Stencil Mi4 Specifications
Product Overview
- Model: AMAOE Stencil Mi4
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for precise reballing of BGA components in electronics repair, ensuring accurate and efficient solder ball placement.
- Material: Premium stainless steel, designed for durability and precision.
- Thickness: 0.12MM for optimal reballing performance and solder ball placement accuracy.
- Dimensions: Compact size for easy handling and transportation in professional repair environments.
- Heat Resistance: Designed to resist high temperatures during soldering operations.
- Compatibility: Suitable for reballing BGA components in smartphones, tablets, and other electronic devices.
Included Components
- Optional Frame Holder: Available with an optional alignment frame for more precise solder ball positioning during reballing.
- Instruction Manual: Includes a guide to assist users in setting up and using the stencil effectively.
Usage
- Target Audience: Aimed at professional electronics repair technicians, especially those involved in BGA component reballing for chip-level repairs.
- Ideal Applications: Suitable for reballing BGA chips used in mobile devices, tablets, and other small electronics requiring high precision.
- New
AMAOE Stencil Mi6
Availability: In Stock
₹160
AMAOE Stencil Mi6 Specifications
Product Overview
- Model: AMAOE Stencil Mi6
- Type: Precision BGA Reballing Stencil
- Purpose: Specially designed for reballing BGA (Ball Grid Array) chips in electronics repair, particularly suited for Mi6 devices and similar components.
- Material: High-quality stainless steel for longevity and resistance to high temperatures.
- Thickness: 0.12MM, providing the right balance between rigidity and flexibility for effective reballing.
- Dimensions: Compact and lightweight for ease of use in repair setups.
- Heat Resistance: Capable of handling high heat required for reballing and soldering processes.
- Compatibility: Perfect for BGA reballing of chips used in Mi6 series devices and similar electronics.
Included Components
- Optional Frame Holder: Available with an optional alignment frame to aid in precise solder ball placement.
- User Guide: Comes with an instruction manual to guide users through the setup and operation of the stencil.
Usage
- Target Audience: Suitable for professional repair technicians and DIY enthusiasts who work on small electronic components, especially those involved in chip-level repairs.
- Application Focus: Best for reballing BGA chips in Mi6 devices, with a high degree of precision and ease of use.
- New
AMAOE Stencil Mi7
Availability: In Stock
₹160
AMAOE Stencil Mi7 Specifications
Product Overview
- Model: AMAOE Stencil Mi7
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for the precise reballing of BGA (Ball Grid Array) chips, specifically tailored for Mi7 devices and compatible electronics.
- Material: High-grade stainless steel for exceptional durability and thermal resistance.
- Thickness: 0.12MM, ideal for precision applications.
- Dimensions: Compact and lightweight, making it easy to handle and integrate into various repair setups.
- Heat Resistance: Engineered to withstand high temperatures commonly encountered during the reballing process.
- Compatibility: Specifically designed for BGA reballing of chips used in Mi7 devices and other similar electronic components.
Included Components
- Optional Frame Holder: Available with an optional alignment frame to aid in precise solder ball placement and alignment.
- User Manual: Comes with an instructional guide for setup and operation, ensuring ease of use for both beginners and experienced technicians.
Usage
- Target Audience: Ideal for professional repair technicians and hobbyists engaged in electronics repair, focusing on chip-level work.
- Application Focus: Best suited for reballing BGA chips in Mi7 devices, ensuring high precision and reliability.
- New
AMAOE Stencil Mi8
Availability: In Stock
₹160
AMAOE Stencil Mi8 Specifications
Product Overview
- Model: AMAOE Stencil Mi8
- Type: Precision BGA Reballing Stencil
- Purpose: Designed specifically for the reballing of BGA (Ball Grid Array) chips in Mi8 devices and compatible electronics.
- Material: High-grade stainless steel, chosen for its durability and thermal resistance.
- Thickness: 0.12MM, ideal for precision work.
- Dimensions: Lightweight and compact, easy to handle and integrate into various repair setups.
- Heat Resistance: Engineered to handle the high temperatures typical of reflow soldering.
- Compatibility: Specifically designed for BGA reballing of chips in Mi8 devices and other similar electronics.
Included Components
- Optional Frame Holder: Available with an optional alignment frame to assist in precise solder ball placement and alignment.
- User Manual: Comes with an instructional guide to facilitate setup and operation, catering to both beginners and experienced technicians.
Usage
- Target Audience: Perfect for professional repair technicians and electronics enthusiasts focusing on chip-level repairs.
- Application Focus: Best suited for the reballing of BGA chips in Mi8 devices, ensuring high accuracy and reliability.
- New
AMAOE Stencil RF2
Availability: In Stock
₹160
AMAOE Stencil RF2 Specifications
Product Overview
- Model: AMAOE Stencil RF2
- Type: Precision BGA Reballing Stencil
- Purpose: Specially designed for the reballing of BGA (Ball Grid Array) chips in RF (Radio Frequency) modules and components.
- Material: High-grade stainless steel to ensure long-lasting use and resistance to corrosion.
- Thickness: 0.12MM, ideal for precision reballing operations.
- Dimensions: Compact and easy to handle, designed to fit perfectly within standard reballing setups.
- Heat Resistance: Specifically engineered to tolerate the high temperatures typical of soldering and reflow processes.
- Compatibility: Designed for RF chip reballing and works with various RF modules and communication components.
Included Components
- Optional Alignment Holder: Includes an optional holder frame for easy alignment and placement of the stencil during reballing.
- User Guide: Comes with a detailed instruction manual for quick setup and efficient operation, ideal for both beginners and experienced technicians.
Usage
- Target Audience: Professional repair technicians and electronics engineers working with RF modules.
- Application Focus: Suitable for the reballing and repair of RF chips and related communication components, ensuring precise reballing with minimal errors.
- New
AMAOE Stencil SU1
Availability: In Stock
₹160
AMAOE Stencil SU1 Specifications
Product Overview
- Model: AMAOE Stencil SU1
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for the reballing of BGA (Ball Grid Array) chips, specifically for certain SoC (System on Chip) and high-performance chips used in smartphones and other electronics.
- Material: Premium stainless steel for long-lasting performance and corrosion resistance.
- Thickness: 0.12MM, perfect for reballing applications requiring precision.
- Dimensions: Compact design for easy handling, suitable for most standard reballing setups.
- Heat Resistance: Engineered to withstand the elevated temperatures involved in the soldering and reflow process.
- Compatibility: Compatible with a variety of System on Chips (SoC) used in modern mobile devices, making it ideal for smartphone repair.
Included Components
- Optional Holder: An alignment holder can be included to assist with proper placement during the reballing process.
- Instruction Manual: Comes with a user guide for easy setup and use, catering to both professionals and those newer to reballing.
Usage
- Target Audience: Repair professionals, technicians, and engineers dealing with smartphone and tablet repairs.
- Applications: Suitable for reballing BGA chips, particularly SoC components in mobile devices, enhancing the efficiency and accuracy of rework.
- New
AMAOE Stencil SU2
Availability: In Stock
₹160
AMAOE Stencil SU2 Specifications
Product Overview
- Model: AMAOE Stencil SU2
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing specific BGA (Ball Grid Array) chips, especially for high-performance processors and SoCs (System on Chip) used in smartphones and electronic devices.
- Material: Stainless steel for longevity and reliability in high-temperature environments.
- Thickness: 0.12MM, optimized for professional reballing tasks requiring precision and durability.
- Dimensions: Compact and easy-to-handle size, fitting standard reballing stations.
- Heat Resistance: Withstands high-temperature exposure during rework, ensuring consistent results.
- Compatibility: Compatible with specific System on Chips (SoCs) and BGA chips found in modern smartphones, tablets, and similar electronic devices.
Included Components
- Optional Alignment Holder: An alignment holder may be included for easier and more accurate positioning of the stencil during the reballing process.
- Instruction Manual: A guide is provided for easy setup and usage, suitable for professional repair technicians and those new to reballing.
Usage
- Target Audience: Professional repair technicians and electronics engineers focusing on smartphone and tablet repair.
- Applications: Specifically designed for reballing operations on BGA chips, SoCs, and other key components in modern electronics, improving repair quality and efficiency.
- New
AMAOE Stencil SU3
Availability: In Stock
₹160
AMAOE Stencil SU3 Specifications
Product Overview
- Model: AMAOE Stencil SU3
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips in high-performance processors, SoCs, and IC components used in modern electronic devices such as smartphones, tablets, and other gadgets.
- Material: Premium stainless steel, ensuring maximum durability and resistance to heat and corrosion.
- Thickness: 0.12MM, offering perfect balance for maintaining flexibility and structural integrity.
- Dimensions: Compact size, compatible with standard reballing stations, providing ease of use in different work environments.
- Heat Resistance: Can withstand high heat during reballing operations, maintaining consistent quality.
- Compatibility: Specifically designed for popular BGA chips used in smartphones, tablets, and other electronic devices, making it a great tool for professionals in the repair industry.
Included Components
- Stencil Holder (Optional): An optional alignment holder may be included for easier and more accurate positioning of the stencil.
- Instruction Manual: Includes a user-friendly manual to help technicians quickly get started with the reballing process.
Usage
- Target Audience: Professional electronics repair technicians and engineers focusing on smartphone, tablet, and consumer electronics repair.
- Applications: Ideal for reballing BGA chips, SoCs, and other key components in mobile devices and consumer electronics, ensuring high-quality and reliable repairs.
- New
AMAOE Stencil SAM1
Availability: In Stock
₹160
AMAOE Stencil SAM1 Specifications
Product Overview
- Model: AMAOE Stencil SAM1
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips, specifically for Samsung processors and IC components used in Samsung smartphones and tablets.
- Material: Premium-grade stainless steel, resistant to corrosion and heat, ensuring longevity.
- Thickness: 0.12MM, offering precision in reballing while maintaining the stencil's integrity.
- Dimensions: Compact size for compatibility with standard reballing tools and workstations.
- Heat Resistance: Designed to withstand high heat during reballing without deforming.
- Compatibility: Specifically compatible with Samsung processors and BGA chips found in Samsung smartphones and tablets, providing accurate and efficient reballing for these devices.
Included Components
- Stencil Holder (Optional): An optional holder for alignment is included to assist with accurate positioning during the reballing process.
- Instruction Guide: Includes a user-friendly manual to guide technicians through the setup and reballing process.
Usage
- Target Audience: Professional repair technicians specializing in Samsung smartphone and tablet repairs.
- Applications: Ideal for reballing Samsung processors and other key BGA components in Samsung devices, ensuring precise and high-quality repairs.
- New
AMAOE Stencil SAM2
Availability: In Stock
₹160
AMAOE Stencil SAM2 Specifications
Product Overview
- Model: AMAOE Stencil SAM2
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips, particularly suited for Samsung processors and integrated circuits used in Samsung devices.
- Material: Premium-grade stainless steel, resistant to corrosion and thermal damage for extended use.
- Thickness: 0.12MM, ideal for maintaining accuracy in reballing while providing the strength needed for multiple uses.
- Dimensions: Compact and easy to handle, compatible with standard reballing setups.
- Heat Resistance: Capable of withstanding the high temperatures typical in reballing applications without distortion.
- Target Devices: Optimized for Samsung processors and key BGA chips found in Samsung mobile devices, ensuring a perfect fit for repairs.
Included Components
- Stencil Holder (Optional): An optional holder may be included to assist in aligning the stencil during the reballing process.
- User Manual: A detailed guide is provided to assist technicians in using the stencil effectively for BGA reballing.
Usage
- Target Audience: Professional repair technicians specializing in Samsung device repairs.
- Applications: Ideal for reballing Samsung processors and other essential BGA components, ensuring high-quality and precise repairs for Samsung smartphones and tablets.
- New
AMAOE Stencil SAM10
Availability: In Stock
₹160
AMAOE Stencil SAM10 Specifications
Product Overview
- Model: AMAOE Stencil SAM10
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips, particularly those used in Samsung devices.
- Material: Premium-grade stainless steel that is resistant to corrosion and thermal damage for extended usage.
- Thickness: 0.15MM, which strikes a good balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design to fit standard reballing equipment and enhance usability in repair processes.
- Heat Resistance: Capable of withstanding the elevated temperatures encountered during soldering without warping or degrading.
- Target Devices: Optimized for Samsung processors and various BGA chips found in Samsung smartphones and tablets, ensuring precise fitting for effective repairs.
Included Components
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage
- Target Audience: Ideal for professional repair technicians specializing in Samsung device repairs.
- Applications: Best suited for reballing Samsung processors and other critical BGA components, ensuring high-quality and accurate repairs for Samsung smartphones and tablets.
- New
AMAOE Stencil SAM11
Availability: In Stock
₹160
AMAOE Stencil SAM11 Specifications
Product Overview:
- Model: AMAOE Stencil SAM11
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips, particularly those used in Samsung devices.
- Weight: Typically around 0.5 kg (verify for specific product details).
Material and Design:
- Material: Premium-grade stainless steel, resistant to corrosion and thermal damage, ensuring durability for extended usage.
- Thickness: 0.15 mm, providing an optimal balance between rigidity and flexibility for multiple reballing cycles.
- Dimensions: Compact design to fit standard reballing equipment, enhancing usability in repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures during soldering without warping or degrading, ensuring reliable performance.
- Target Devices: Optimized for a variety of Samsung processors and BGA chips found in Samsung smartphones and tablets, ensuring precise fitting for effective repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to aid in proper alignment of the stencil during the reballing process.
- User Manual: A comprehensive guide provided to assist technicians in utilizing the stencil effectively for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in Samsung device repairs.
- Applications: Best suited for reballing Samsung processors and other critical BGA components, ensuring high-quality and accurate repairs for Samsung smartphones and tablets.
The AMAOE Stencil SAM11 is designed to meet the needs of technicians performing BGA reballing, particularly for Samsung devices, providing precision and reliability in their repair processes
- New
AMAOE Stencil SAM3
Availability: In Stock
₹160
AMAOE Stencil SAM3 Specifications
Product Overview
- Model: AMAOE Stencil SAM3
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips, particularly suited for Samsung processors and integrated circuits used in Samsung devices.
- Material: Premium-grade stainless steel, resistant to corrosion and thermal damage for extended use.
- Thickness: 0.12MM, ideal for maintaining accuracy in reballing while providing the strength needed for multiple uses.
- Dimensions: Compact and easy to handle, compatible with standard reballing setups.
- Heat Resistance: Capable of withstanding high temperatures typical in reballing applications without distortion.
- Target Devices: Optimized for Samsung processors and key BGA chips found in Samsung mobile devices, ensuring a perfect fit for repairs.
Included Components
- Stencil Holder (Optional): An optional holder may be included to assist in aligning the stencil during the reballing process.
- User Manual: A detailed guide is provided to assist technicians in using the stencil effectively for BGA reballing.
Usage
- Target Audience: Professional repair technicians specializing in Samsung device repairs.
- Applications: Ideal for reballing Samsung processors and other essential BGA components, ensuring high-quality and precise repairs for Samsung smartphones and tablets.
- New
AMAOE Stencil SAM12
Availability: In Stock
₹160
AMAOE Stencil SAM12 Specifications
Product Overview:
- Model: AMAOE Stencil SAM12
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in Samsung devices.
- Weight: Typically around 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, resistant to corrosion and thermal damage for extended use.
- Thickness: 0.15 mm, providing an optimal balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design compatible with standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Designed to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliability.
- Target Devices: Optimized for various Samsung processors and BGA chips found in Samsung smartphones and tablets, ensuring precise fitting for effective repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in Samsung device repairs.
- Applications: Best suited for reballing Samsung processors and other critical BGA components, ensuring high-quality and accurate repairs for Samsung smartphones and tablets.
The AMAOE Stencil SAM12 is engineered to provide technicians with a reliable and precise tool for BGA reballing, particularly focused on the needs of Samsung device repairs.
- New
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