AMAOE Stencil U-QSU4
Availability: In Stock
₹160
AMAOE Stencil U-QSU4 Specifications
Product Overview
- Model: AMAOE U-QSU4
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSU4 is expertly designed for BGA (Ball Grid Array) reballing applications, serving as an essential tool for electronics repair technicians. This stencil ensures precise alignment and accurate placement of solder balls on various chips, enabling reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Suitable for various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSU4 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil Mi9
Availability: In Stock
₹160
AMAOE Stencil Mi9 Specifications
Product Overview
- Model: AMAOE Mi9 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil Mi9 is specifically designed for reballing BGA chips used in the Xiaomi Mi9 series. It is an essential tool for electronics repair professionals, ensuring precise alignment and accurate placement of solder balls on chips for high-quality repair and rework tasks.
- Material: High-grade stainless steel for enhanced durability and rust resistance.
- Thickness: 0.12MM, providing precision in solder ball placement.
- Dimensions: Compact and easy to handle, designed for use in delicate electronics repair environments.
- Heat Resistance: Supports soldering operations with heat tolerance up to 500°C.
- Compatibility: Specifically tailored for Xiaomi Mi9 series BGA chips.
Included Accessories
- Optional Frame: An optional alignment frame may be included to assist in precise positioning during the reballing process.
- User Manual: Detailed instructions for usage and maintenance to ensure the best performance.
Usage
- Designed for: Electronics repair professionals focusing on Xiaomi Mi9 BGA chip reballing. The AMAOE Mi9 stencil is an essential tool for achieving accurate solder ball placement during the repair of Xiaomi Mi9 devices, ensuring efficient and high-quality repairs.
- New
AMAOE Stencil NAND1
Availability: In Stock
₹160
AMAOE Stencil NAND1 Specifications
Product Overview
- Model: AMAOE NAND1 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil NAND1 is designed for the reballing of NAND chips, crucial in repair and rework tasks for smartphones, tablets, and other devices. It ensures precise alignment and solder ball placement for high-quality repairs, especially for NAND memory chips commonly used in mobile devices.
- Material: High-grade stainless steel for maximum strength and corrosion resistance.
- Thickness: 0.12MM, offering precision in handling solder balls and reballing chips.
- Dimensions: Compact, ideal for use in electronics repair workstations, ensuring easy handling during reballing.
- Heat Resistance: Withstands temperatures up to 500°C, ideal for high-temperature soldering tasks.
- Compatibility: Suitable for various NAND memory chips used in mobile devices, including smartphones and tablets.
Included Accessories
- Optional Alignment Frame: Some packages may include an alignment frame to assist with precise solder ball placement.
- User Guide: Detailed instructions to ensure proper use and maintenance of the stencil for optimal results.
Usage
- Best For: Electronics repair professionals specializing in NAND chip reballing and repairs. This stencil is an essential tool for achieving accurate solder ball placement in NAND chips, ensuring high-quality and reliable repairs in mobile devices.
- New
AMAOE Stencil OV1
Availability: In Stock
₹160
AMAOE Stencil OV1 Specifications
Product Overview
- Model: AMAOE OV1 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV1 is designed for the reballing of specific BGA chips in electronics repair, particularly focusing on chipsets used in mobile devices. It ensures accurate alignment and placement of solder balls, which is essential for achieving high-quality repairs and rework.
- Material: High-grade stainless steel, ensuring strength and resistance to rust and wear.
- Thickness: 0.12MM for optimal precision in solder ball placement.
- Dimensions: Compact and portable, designed to fit perfectly into electronics repair workstations.
- Heat Resistance: Withstands temperatures up to 500°C, supporting intensive reballing operations.
- Compatibility: Suitable for specific BGA chips used in various mobile devices, including smartphones and tablets.
Included Accessories
- Optional Alignment Frame: Some variants may include an alignment frame to assist in precise solder ball placement.
- User Instructions: Comprehensive guide to ensure proper usage and maintenance, optimizing the stencil's performance.
Usage
- Target Users: Professional electronics repair technicians, particularly those specializing in mobile device BGA chip reballing. This stencil is essential for achieving precision in repairs involving chipsets used in smartphones and tablets.
- New
AMAOE Stencil OV3
Availability: In Stock
₹160
AMAOE Stencil OV3 Specifications
Product Overview
- Model: AMAOE OV3 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV3 is specifically designed for precise reballing of BGA (Ball Grid Array) chips, commonly used in mobile devices, tablets, and other electronics. This stencil provides exceptional accuracy for solder ball placement, critical for high-quality repair and rework of chipsets.
- Material: Premium stainless steel, ensuring durability and corrosion resistance for long-term professional use.
- Thickness: 0.12MM, providing accuracy and control in the reballing process.
- Dimensions: Compact and easy to handle, fits seamlessly into electronic repair workstations.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ensuring reliability during soldering tasks.
- Compatibility: Designed for specific BGA chips, compatible with a wide range of mobile devices and other electronics.
Included Accessories
- Alignment Frame (Optional): Some packages may include an alignment frame to facilitate the precise positioning of solder balls.
- User Guide: Detailed instructions for optimal use, ensuring effective and safe reballing with the stencil.
Usage
- Best Suited For: Electronics repair professionals who specialize in BGA chip reballing, particularly for mobile devices and tablets. This stencil ensures precision and efficiency in reballing, essential for reliable chipset repairs.
- New
AMAOE Stencil OV4
Availability: In Stock
₹160
AMAOE Stencil OV4 Specifications
Product Overview
- Model: AMAOE OV4 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV4 is meticulously designed for reballing BGA (Ball Grid Array) chips used in various electronic devices, especially mobile phones and tablets. This stencil guarantees high accuracy in solder ball placement, which is crucial for ensuring optimal performance and reliability in repaired components.
- Material: High-grade stainless steel, ensuring a long-lasting and corrosion-resistant stencil.
- Thickness: 0.12MM, providing precision and reliability in solder ball placement.
- Dimensions: Compact and user-friendly, easily fitting into standard electronic repair workstations.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, supporting high-temperature reballing tasks.
- Compatibility: Specifically designed for various BGA chipsets used in mobile devices, ensuring it meets the needs of modern electronics repair.
Included Accessories
- Optional Alignment Frame: Some models may include an alignment frame to assist with the precise positioning of solder balls.
- Instruction Manual: Comes with a detailed user guide to ensure proper usage and maintenance, optimizing the stencil's performance.
Usage
- Target Audience: Ideal for professional electronics repair technicians who specialize in BGA reballing for mobile devices and tablets. This stencil aids in achieving precision and efficiency, essential for high-quality repairs.
- New
AMAOE Stencil OV5
Availability: In Stock
₹160
AMAOE Stencil OV5 Specifications
Product Overview
- Model: AMAOE OV5 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV5 is expertly designed for reballing BGA (Ball Grid Array) chips found in a variety of electronic devices, particularly smartphones and tablets. This stencil ensures precise solder ball placement, crucial for maintaining the performance and reliability of repaired components.
- Material: High-grade stainless steel for durability and long-lasting performance.
- Thickness: 0.12MM, providing the precision needed for effective solder ball placement.
- Dimensions: Compact design for easy handling and integration into electronic repair workstations.
- Heat Resistance: Withstands temperatures up to 500°C, supporting high-temperature reballing operations.
- Compatibility: Tailored for a variety of BGA chipsets used in mobile electronics, meeting the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: Some models may include an alignment frame to aid in precise solder ball placement.
- User Manual: Comes with a detailed instruction manual to ensure proper usage and maintenance, optimizing performance.
Usage
- Target Audience: Ideal for professional electronics repair technicians specializing in BGA reballing for mobile devices and tablets. This stencil is essential for achieving accuracy and efficiency in high-quality repairs.
- New
AMAOE Stencil OV6
Availability: In Stock
₹160
AMAOE Stencil OV6 Specifications
Product Overview
- Model: AMAOE OV6 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV6 is specifically designed for reballing BGA (Ball Grid Array) chips in electronic devices, including smartphones and tablets. It facilitates accurate solder ball placement, ensuring the reliability and performance of repaired components.
- Material: High-grade stainless steel for enhanced durability and performance.
- Thickness: 0.12MM, providing the precision necessary for effective solder ball placement.
- Dimensions: Compact and efficient design for easy handling and integration into electronic repair workstations.
- Heat Resistance: Can endure temperatures up to 500°C, supporting high-temperature reballing operations.
- Compatibility: Tailored for a variety of BGA chipsets found in mobile electronics, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: Some models may include an alignment frame to assist with precise solder ball placement.
- User Manual: Comes with a detailed instruction manual to ensure proper usage and maintenance, maximizing performance.
Usage
- Target Audience: Ideal for professional electronics repair technicians specializing in BGA reballing for mobile devices and tablets. This stencil is essential for achieving accuracy and efficiency in high-quality repairs.
- New
AMAOE Stencil OV7
Availability: In Stock
₹160
AMAOE Stencil OV7 Specifications
Product Overview
- Model: AMAOE OV7 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV7 is specifically designed for reballing BGA (Ball Grid Array) chips in electronic devices, ensuring accurate and efficient solder ball placement for reliable repairs.
- Material: High-grade stainless steel for enhanced durability and performance.
- Thickness: 0.12MM, providing the precision necessary for effective solder ball placement.
- Dimensions: Compact and efficient design for easy handling and integration into electronic repair workstations.
- Heat Resistance: Can endure temperatures up to 500°C, supporting high-temperature reballing operations.
- Compatibility: Tailored for various BGA chipsets found in mobile electronics, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: Some models may include an alignment frame to assist with precise solder ball placement.
- User Manual: Comes with a detailed instruction manual to ensure proper usage and maintenance, maximizing performance.
Usage
- Target Audience: Ideal for professional electronics repair technicians specializing in BGA reballing for mobile devices and tablets. This stencil is essential for achieving accuracy and efficiency in high-quality repairs.
- New
AMAOE Stencil OV8
Availability: In Stock
₹160
AMAOE Stencil OV8 Specifications
Product Overview
- Model: AMAOE OV8 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV8 is designed for the reballing of BGA (Ball Grid Array) chips in various electronic devices, providing precise solder ball placement essential for high-quality repairs.
- Material: High-grade stainless steel for improved durability and performance.
- Thickness: 0.12MM, providing the precision necessary for effective solder ball placement.
- Dimensions: Compact and efficient design for easy handling and integration into electronic repair workstations.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, supporting high-temperature reballing operations.
- Compatibility: Specifically tailored for various BGA chipsets found in mobile electronics, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: May include an alignment frame for enhanced precision in solder ball placement.
- User Manual: Comes with a detailed instruction manual to ensure proper usage and maintenance, optimizing performance.
Usage
- Target Audience: Ideal for professional electronics repair technicians specializing in BGA reballing for mobile devices and tablets. The AMAOE Stencil OV8 is crucial for achieving accuracy and efficiency in high-quality repairs.
- New
AMAOE Stencil PCIE/NAND-0.25MM
Availability: In Stock
₹160
AMAOE Stencil PCIE/NAND - 0.25MM Specifications
Product Overview
- Model: AMAOE Stencil PCIE/NAND
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil PCIE/NAND is specifically designed for the reballing of PCIE and NAND BGA chips, facilitating precise solder ball placement essential for high-quality electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.25MM, ensuring accurate solder ball placement for effective reballing.
- Dimensions: Compact and user-friendly design, making it easy to handle in repair tasks.
- Heat Resistance: Supports high-temperature applications, resistant up to 500°C.
- Compatibility: Specifically tailored for various PCIE and NAND chipsets, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: May include an alignment frame for enhanced precision in solder ball placement.
- User Manual: Comes with a comprehensive user manual to guide proper usage and maintenance, optimizing performance and longevity.
Usage
- Target Audience: Ideal for professional electronics repair technicians specializing in BGA reballing for PCIE and NAND components. The AMAOE Stencil PCIE/NAND - 0.25MM is crucial for achieving accuracy and efficiency in high-quality repairs.
- New
AMAOE Stencil PM1
Availability: In Stock
₹160
AMAOE Stencil PM1 Specifications
Product Overview
- Model: AMAOE Stencil PM1
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil PM1 is designed for reballing various BGA (Ball Grid Array) components, ensuring precise alignment and placement of solder balls for effective electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, providing optimal control over solder ball placement.
- Dimensions: Compact design for ease of use in various repair scenarios.
- Heat Resistance: Supports high-temperature applications, resistant up to 500°C.
- Compatibility: Tailored for various BGA components, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: May include an alignment frame to improve precision in solder ball placement.
- User Manual: Comes with a comprehensive user manual to assist with proper usage and maintenance, optimizing performance and longevity.
Usage
- Target Audience: Ideal for professional electronics repair technicians who specialize in BGA reballing. The AMAOE Stencil PM1 is essential for achieving high-quality and efficient repairs.
- New
AMAOE Stencil QU1
Availability: In Stock
₹160
AMAOE Stencil QU1 Specifications
Product Overview
- Model: AMAOE Stencil QU1
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil QU1 is designed for reballing BGA (Ball Grid Array) components, ensuring accurate solder ball placement essential for effective electronic repairs.
- Material: High-grade stainless steel for durability and precision.
- Thickness: 0.15MM, ensuring accuracy during the solder ball application.
- Dimensions: Designed to be compact for ease of use in various repair scenarios.
- Heat Resistance: Withstands temperatures up to 500°C, ensuring reliability during soldering applications.
- Compatibility: Designed for a wide range of BGA components, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: May come with an optional alignment frame for enhanced accuracy in solder ball placement.
- User Manual: Accompanied by a user manual that provides instructions for proper usage and maintenance, promoting longevity and optimal performance.
Usage
- Target Audience: Ideal for electronics repair professionals specializing in BGA reballing. The AMAOE Stencil QU1 is a crucial tool for achieving high-quality repairs efficiently.
- New
AMAOE Stencil PM2
Availability: In Stock
₹160
AMAOE Stencil PM2 Specifications
Product Overview
- Model: AMAOE Stencil PM2
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil PM2 is specifically designed for the reballing of BGA (Ball Grid Array) components, ensuring precise alignment and optimal solder ball placement for effective electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, providing optimal control for solder ball placement.
- Dimensions: Compact design for ease of use in different repair scenarios.
- Heat Resistance: Withstands high temperatures, resistant up to 500°C.
- Compatibility: Specifically tailored for a variety of BGA components, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: May include an alignment frame to enhance precision in solder ball placement.
- User Manual: Comes with a detailed user manual to assist with proper usage and maintenance, optimizing performance and longevity.
Usage
- Target Audience: Ideal for professional electronics repair technicians who specialize in BGA reballing. The AMAOE Stencil PM2 is essential for achieving high-quality and efficient repairs.
- New
AMAOE Stencil PM3
Availability: In Stock
₹160
AMAOE Stencil PM3 Specifications
Product Overview
- Model: AMAOE Stencil PM3
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil PM3 is designed for the reballing of various BGA (Ball Grid Array) components, providing precise alignment and optimal solder ball placement essential for high-quality electronic repairs.
- Material: High-quality stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, allowing for optimal control during solder ball application.
- Dimensions: Compact design tailored for ease of use across different repair scenarios.
- Heat Resistance: Withstands high temperatures, resistant up to 500°C.
- Compatibility: Specifically designed for various BGA components, meeting the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: May include an alignment frame to improve accuracy in solder ball placement.
- User Manual: Comes with a detailed user manual to guide proper usage and maintenance, enhancing performance and longevity.
Usage
- Target Audience: Ideal for professional electronics repair technicians who specialize in BGA reballing. The AMAOE Stencil PM3 is crucial for achieving efficient and high-quality repairs.
- New
AMAOE Stencil QU2
Availability: In Stock
₹160
AMAOE Stencil QU2 Specifications
Product Overview
- Model: AMAOE Stencil QU2
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil QU2 is specifically designed for reballing BGA (Ball Grid Array) components, ensuring accurate and efficient solder ball placement for electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, promoting accuracy in solder ball application.
- Dimensions: Compact design for easy handling and usability in different repair scenarios.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ensuring performance under demanding conditions.
- Compatibility: Suitable for a wide range of BGA components, catering to the needs of electronic repair professionals.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame for improved accuracy during solder ball placement.
- User Manual: Comes with a user manual providing guidelines for proper usage and maintenance, ensuring optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair professionals focusing on BGA reballing. The AMAOE Stencil QU2 is an essential tool for achieving high-quality repairs efficiently.
- New
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