AMAOE Stencil OV8
Availability: In Stock
₹159
AMAOE Stencil OV8 Specifications
Product Overview
- Model: AMAOE OV8 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV8 is designed for the reballing of BGA (Ball Grid Array) chips in various electronic devices, providing precise solder ball placement essential for high-quality repairs.
- Material: High-grade stainless steel for improved durability and performance.
- Thickness: 0.12MM, providing the precision necessary for effective solder ball placement.
- Dimensions: Compact and efficient design for easy handling and integration into electronic repair workstations.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, supporting high-temperature reballing operations.
- Compatibility: Specifically tailored for various BGA chipsets found in mobile electronics, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: May include an alignment frame for enhanced precision in solder ball placement.
- User Manual: Comes with a detailed instruction manual to ensure proper usage and maintenance, optimizing performance.
Usage
- Target Audience: Ideal for professional electronics repair technicians specializing in BGA reballing for mobile devices and tablets. The AMAOE Stencil OV8 is crucial for achieving accuracy and efficiency in high-quality repairs.
- New
AMAOE Stencil PCIE/NAND-0.25MM
Availability: In Stock
₹159
AMAOE Stencil PCIE/NAND - 0.25MM Specifications
Product Overview
- Model: AMAOE Stencil PCIE/NAND
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil PCIE/NAND is specifically designed for the reballing of PCIE and NAND BGA chips, facilitating precise solder ball placement essential for high-quality electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.25MM, ensuring accurate solder ball placement for effective reballing.
- Dimensions: Compact and user-friendly design, making it easy to handle in repair tasks.
- Heat Resistance: Supports high-temperature applications, resistant up to 500°C.
- Compatibility: Specifically tailored for various PCIE and NAND chipsets, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: May include an alignment frame for enhanced precision in solder ball placement.
- User Manual: Comes with a comprehensive user manual to guide proper usage and maintenance, optimizing performance and longevity.
Usage
- Target Audience: Ideal for professional electronics repair technicians specializing in BGA reballing for PCIE and NAND components. The AMAOE Stencil PCIE/NAND - 0.25MM is crucial for achieving accuracy and efficiency in high-quality repairs.
- New
AMAOE Stencil PM1
Availability: In Stock
₹159
AMAOE Stencil PM1 Specifications
Product Overview
- Model: AMAOE Stencil PM1
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil PM1 is designed for reballing various BGA (Ball Grid Array) components, ensuring precise alignment and placement of solder balls for effective electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, providing optimal control over solder ball placement.
- Dimensions: Compact design for ease of use in various repair scenarios.
- Heat Resistance: Supports high-temperature applications, resistant up to 500°C.
- Compatibility: Tailored for various BGA components, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: May include an alignment frame to improve precision in solder ball placement.
- User Manual: Comes with a comprehensive user manual to assist with proper usage and maintenance, optimizing performance and longevity.
Usage
- Target Audience: Ideal for professional electronics repair technicians who specialize in BGA reballing. The AMAOE Stencil PM1 is essential for achieving high-quality and efficient repairs.
- New
AMAOE Stencil QU1
Availability: In Stock
₹159
AMAOE Stencil QU1 Specifications
Product Overview
- Model: AMAOE Stencil QU1
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil QU1 is designed for reballing BGA (Ball Grid Array) components, ensuring accurate solder ball placement essential for effective electronic repairs.
- Material: High-grade stainless steel for durability and precision.
- Thickness: 0.15MM, ensuring accuracy during the solder ball application.
- Dimensions: Designed to be compact for ease of use in various repair scenarios.
- Heat Resistance: Withstands temperatures up to 500°C, ensuring reliability during soldering applications.
- Compatibility: Designed for a wide range of BGA components, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: May come with an optional alignment frame for enhanced accuracy in solder ball placement.
- User Manual: Accompanied by a user manual that provides instructions for proper usage and maintenance, promoting longevity and optimal performance.
Usage
- Target Audience: Ideal for electronics repair professionals specializing in BGA reballing. The AMAOE Stencil QU1 is a crucial tool for achieving high-quality repairs efficiently.
- New
AMAOE Stencil PM2
Availability: In Stock
₹159
AMAOE Stencil PM2 Specifications
Product Overview
- Model: AMAOE Stencil PM2
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil PM2 is specifically designed for the reballing of BGA (Ball Grid Array) components, ensuring precise alignment and optimal solder ball placement for effective electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, providing optimal control for solder ball placement.
- Dimensions: Compact design for ease of use in different repair scenarios.
- Heat Resistance: Withstands high temperatures, resistant up to 500°C.
- Compatibility: Specifically tailored for a variety of BGA components, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: May include an alignment frame to enhance precision in solder ball placement.
- User Manual: Comes with a detailed user manual to assist with proper usage and maintenance, optimizing performance and longevity.
Usage
- Target Audience: Ideal for professional electronics repair technicians who specialize in BGA reballing. The AMAOE Stencil PM2 is essential for achieving high-quality and efficient repairs.
- New
AMAOE Stencil PM3
Availability: In Stock
₹159
AMAOE Stencil PM3 Specifications
Product Overview
- Model: AMAOE Stencil PM3
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil PM3 is designed for the reballing of various BGA (Ball Grid Array) components, providing precise alignment and optimal solder ball placement essential for high-quality electronic repairs.
- Material: High-quality stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, allowing for optimal control during solder ball application.
- Dimensions: Compact design tailored for ease of use across different repair scenarios.
- Heat Resistance: Withstands high temperatures, resistant up to 500°C.
- Compatibility: Specifically designed for various BGA components, meeting the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: May include an alignment frame to improve accuracy in solder ball placement.
- User Manual: Comes with a detailed user manual to guide proper usage and maintenance, enhancing performance and longevity.
Usage
- Target Audience: Ideal for professional electronics repair technicians who specialize in BGA reballing. The AMAOE Stencil PM3 is crucial for achieving efficient and high-quality repairs.
- New
AMAOE Stencil QU2
Availability: In Stock
₹159
AMAOE Stencil QU2 Specifications
Product Overview
- Model: AMAOE Stencil QU2
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil QU2 is specifically designed for reballing BGA (Ball Grid Array) components, ensuring accurate and efficient solder ball placement for electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, promoting accuracy in solder ball application.
- Dimensions: Compact design for easy handling and usability in different repair scenarios.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ensuring performance under demanding conditions.
- Compatibility: Suitable for a wide range of BGA components, catering to the needs of electronic repair professionals.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame for improved accuracy during solder ball placement.
- User Manual: Comes with a user manual providing guidelines for proper usage and maintenance, ensuring optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair professionals focusing on BGA reballing. The AMAOE Stencil QU2 is an essential tool for achieving high-quality repairs efficiently.
- New
AMAOE Stencil QU3
Availability: In Stock
₹159
AMAOE Stencil QU3 Specifications
Product Overview
- Model: AMAOE Stencil QU3
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil QU3 is engineered for reballing BGA (Ball Grid Array) components, ensuring precise solder ball placement necessary for high-quality electronic repairs.
- Material: High-grade stainless steel, ensuring durability and precision.
- Thickness: 0.15MM, allowing for precise solder ball application.
- Dimensions: Compact design for ease of use in various repair scenarios.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, suitable for demanding soldering conditions.
- Compatibility: Designed for a broad range of BGA components, catering to the diverse needs of electronic repair technicians.
Included Accessories
- Optional Alignment Frame: May come with an optional alignment frame for enhanced accuracy in solder ball placement.
- User Manual: Includes a user manual with instructions for proper usage and maintenance to ensure longevity and optimal performance.
Usage
- Target Audience: Perfect for electronics repair professionals specializing in BGA reballing. The AMAOE Stencil QU3 is an essential tool for achieving efficient and high-quality repairs.
- New
AMAOE Stencil QU4
Availability: In Stock
₹159
AMAOE Stencil QU4 Specifications
Product Overview
- Model: AMAOE Stencil QU4
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil QU4 is designed for reballing BGA (Ball Grid Array) components, ensuring accurate solder ball placement essential for high-quality electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, promoting accuracy in solder ball application.
- Dimensions: Compact design for easy handling and usability in different repair scenarios.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, suitable for demanding soldering conditions.
- Compatibility: Designed for various BGA components, meeting the needs of electronics repair professionals.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to improve accuracy during solder ball placement.
- User Manual: Comes with a user manual providing guidelines for proper usage and maintenance, ensuring optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair professionals focusing on BGA reballing. The AMAOE Stencil QU4 is an essential tool for achieving high-quality repairs efficiently.
- New
AMAOE Stencil QU5
Availability: In Stock
₹159
AMAOE Stencil QU5 Specifications
Product Overview
- Model: AMAOE Stencil QU5
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil QU5 is specifically designed for reballing BGA (Ball Grid Array) components, ensuring precise solder ball placement essential for high-quality electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, promoting accuracy in solder ball application.
- Dimensions: Compact design for easy handling and usability in different repair scenarios.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, suitable for demanding soldering conditions.
- Compatibility: Designed for various BGA components, meeting the needs of electronics repair professionals.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to improve accuracy during solder ball placement.
- User Manual: Comes with a user manual providing guidelines for proper usage and maintenance, ensuring optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair professionals focusing on BGA reballing. The AMAOE Stencil QU5 is an essential tool for achieving high-quality repairs efficiently.
- New
AMAOE Stencil QU6
Availability: In Stock
₹159
AMAOE Stencil QU6 Specifications
Product Overview
- Model: AMAOE Stencil QU6
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for reballing BGA (Ball Grid Array) components, ensuring precise placement of solder balls for optimal electrical connectivity and reliability in electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, allowing for precise solder ball placement.
- Dimensions: Compact design to facilitate easy handling and usability across various repair environments.
- Heat Resistance: Capable of enduring temperatures up to 500°C, suitable for high-temperature soldering processes.
- Compatibility: Designed for various BGA components, making it ideal for electronics repair professionals.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to aid in accurate solder ball placement during repairs.
- User Manual: Comes with a user manual detailing usage instructions and maintenance tips to ensure optimal performance and longevity.
Usage
- Target Audience: Perfect for electronics repair technicians specializing in BGA reballing. The AMAOE Stencil QU6 is essential for achieving high-quality, efficient repairs in the electronics sector.
- New
AMAOE Stencil QU8
Availability: In Stock
₹159
AMAOE Stencil QU8 Specifications
Product Overview
- Model: AMAOE Stencil QU8
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for the accurate reballing of BGA (Ball Grid Array) components, ensuring precise solder ball placement for improved electrical connections in electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, ensuring accurate solder ball placement for effective repairs.
- Dimensions: Compact and ergonomic design for ease of handling in different repair environments.
- Heat Resistance: Capable of enduring temperatures up to 500°C, suitable for high-temperature soldering processes.
- Compatibility: Specifically engineered for a variety of BGA components, making it essential for electronics repair professionals.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to assist in achieving accurate solder ball placement during reballing.
- User Manual: Comes with a detailed user manual providing usage instructions and maintenance tips for optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair technicians specializing in BGA reballing. The AMAOE Stencil QU8 is essential for achieving high-quality, efficient repairs in the electronics industry.
- New
AMAOE Stencil RF1
Availability: In Stock
₹159
AMAOE Stencil RF1 Specifications
Product Overview
- Model: AMAOE Stencil RF1
- Type: Precision BGA Reballing Stencil
- Purpose: Specifically designed for the precise reballing of BGA (Ball Grid Array) components, ensuring accurate solder ball placement for reliable electrical connections in electronic repairs.
- Material: High-quality stainless steel for superior durability and precision.
- Thickness: 0.15MM, ensuring accurate solder ball placement for effective repairs.
- Dimensions: Compact design for easy handling and use in different repair environments.
- Heat Resistance: Capable of withstanding high temperatures suitable for reballing applications.
- Compatibility: Engineered for various BGA components, making it an essential tool for electronics repair professionals.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to assist in achieving accurate solder ball placement during the reballing process.
- User Manual: Comes with a detailed user manual providing usage instructions and maintenance tips for optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair technicians specializing in BGA reballing. The AMAOE Stencil RF1 is essential for achieving high-quality, efficient repairs in the electronics industry.
- New
AMAOE Stencil QU7
Availability: In Stock
₹159
AMAOE Stencil QU7 Specifications
Product Overview
- Model: AMAOE Stencil QU7
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for the precise reballing of BGA (Ball Grid Array) components, ensuring optimal solder ball placement for enhanced electrical connectivity and reliability in electronic repairs.
- Material: High-grade stainless steel for enhanced longevity and precision.
- Thickness: 0.15MM, ensuring accurate solder ball placement during repairs.
- Dimensions: Compact and user-friendly design for easy handling in various repair settings.
- Heat Resistance: Capable of enduring temperatures up to 500°C, suitable for high-temperature soldering processes.
- Compatibility: Specifically designed for numerous BGA components, making it ideal for professional electronics repair technicians.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to assist in achieving accurate solder ball placement during the reballing process.
- User Manual: Comes with a comprehensive user manual providing usage instructions and maintenance tips to ensure optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair technicians specializing in BGA reballing. The AMAOE Stencil QU7 is essential for achieving high-quality and efficient repairs in the electronics industry.
- New
AMAOE Stencil U-QSU5
Availability: In Stock
₹159
AMAOE Stencil U-QSU5 Specifications
Product Overview
- Model: AMAOE Stencil U-QSU5
- Type: Precision BGA Reballing Stencil
- Purpose: Designed specifically for the reballing of various BGA (Ball Grid Array) components, ensuring accurate solder ball placement to facilitate reliable electrical connections in electronic devices.
- Material: High-grade stainless steel for superior durability and performance.
- Thickness: 0.15MM, providing accurate solder ball placement for effective reballing.
- Dimensions: Compact design that facilitates easy handling and usability in diverse repair environments.
- Heat Resistance: Capable of enduring high temperatures suitable for reballing applications.
- Compatibility: Engineered for various BGA components, making it an essential tool for technicians in the electronics repair field.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to assist with achieving precise solder ball placement during the reballing process.
- User Manual: Comes with a detailed user manual that provides instructions for use and maintenance tips to ensure optimal performance.
Usage
- Target Audience: Ideal for electronics repair technicians specializing in BGA reballing. The AMAOE Stencil U-QSU5 is essential for achieving high-quality and efficient repairs in the electronics industry.
- New
AMAOE Stencil Mi2
Availability: In Stock
₹159
AMAOE Stencil Mi2 Specifications
Product Overview
- Model: AMAOE Stencil Mi2
- Type: Precision BGA Reballing Stencil
- Purpose: Specifically designed for reballing various BGA (Ball Grid Array) components in electronic devices, ensuring accurate solder ball placement for reliable connections.
- Material: High-grade stainless steel for exceptional durability and performance.
- Thickness: 0.15MM, providing precise solder ball placement and effective reballing.
- Dimensions: Compact and lightweight design for easy handling and usability in various repair settings.
- Heat Resistance: Able to endure high temperatures typically encountered during soldering processes.
- Compatibility: Engineered for a range of BGA components, essential for technicians working in the electronics repair field.
Included Accessories
- Optional Alignment Frame: May come with an optional alignment frame to assist in achieving accurate solder ball placement during the reballing process.
- User Manual: Includes a detailed user manual with usage instructions and maintenance tips to ensure optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair technicians specializing in BGA reballing. The AMAOE Stencil Mi2 is crucial for delivering high-quality repairs in the electronics industry.
- New
