AMAOE Stencil U-QSD1
Availability: In Stock
₹160
AMAOE Stencil U-QSD1 Specifications
Product Overview
- Model: AMAOE U-QSD1
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD1 is specifically designed for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil ensures precise alignment and accurate placement of solder balls on various chips, enabling reliable repairs for smartphones, tablets, and other electronic devices.
- Material: Premium stainless steel for enhanced durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for easy handling and use in tight electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Suitable for a diverse range of BGA chip sizes, enhancing usability across multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD1 stencil is essential for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD2
Availability: In Stock
₹160
AMAOE Stencil U-QSD2 Specifications
Product Overview
- Model: AMAOE U-QSD2
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD2 is specifically designed for BGA (Ball Grid Array) reballing applications. It is an essential tool for electronics repair professionals, ensuring precise alignment and accurate placement of solder balls on various chips, which facilitates reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Suitable for a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD2 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD5
Availability: In Stock
₹160
AMAOE Stencil U-QSD5 Specifications
Product Overview
- Model: AMAOE U-QSD5
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD5 is expertly designed for BGA (Ball Grid Array) reballing applications. This stencil is an essential tool for electronics repair professionals, ensuring precise alignment and accurate placement of solder balls on various chips, facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact and lightweight design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Suitable for diverse BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Offers essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD5 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD3
Availability: In Stock
₹160
AMAOE Stencil U-QSD3 Specifications
Product Overview
- Model: AMAOE U-QSD3
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD3 is engineered for BGA (Ball Grid Array) reballing applications. This tool is essential for electronics repair professionals, ensuring precise alignment and accurate placement of solder balls on various chips, which facilitates reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact and lightweight design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering tasks.
- Compatibility: Suitable for various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD3 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD7
Availability: In Stock
₹160
AMAOE Stencil U-QSD7 Specifications
Product Overview
- Model: AMAOE U-QSD7
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD7 is expertly designed for BGA (Ball Grid Array) reballing applications. This stencil is an indispensable tool for electronics repair technicians, ensuring precise alignment and accurate placement of solder balls on various chips, thus facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact and lightweight design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Suitable for a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Offers essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD7 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD4
Availability: In Stock
₹160
AMAOE Stencil U-QSD4 Specifications
Product Overview
- Model: AMAOE U-QSD4
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD4 is meticulously designed for BGA (Ball Grid Array) reballing applications. This stencil is essential for electronics repair professionals, enabling precise alignment and accurate placement of solder balls on various chips, which facilitates reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, suitable for various high-temperature soldering tasks.
- Compatibility: Designed to work with a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD4 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD6
Availability: In Stock
₹160
AMAOE Stencil U-QSD6 Specifications
Product Overview
- Model: AMAOE U-QSD6
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD6 is meticulously crafted for BGA (Ball Grid Array) reballing applications. This stencil is an essential tool for electronics repair technicians, ensuring precise alignment and accurate placement of solder balls on a variety of chips, facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, suitable for various high-temperature soldering tasks.
- Compatibility: Designed to work with a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD6 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD8
Availability: In Stock
₹160
AMAOE Stencil U-QSD8 Specifications
Product Overview
- Model: AMAOE U-QSD8
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD8 is specifically designed for BGA (Ball Grid Array) reballing applications. This high-quality stencil is essential for electronics repair technicians, ensuring precise alignment and accurate placement of solder balls on a variety of chips, facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, providing precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Designed to work with a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD8 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD9
Availability: In Stock
₹160
AMAOE Stencil U-QSD9 Specifications
Product Overview
- Model: AMAOE U-QSD9
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD9 is engineered for BGA (Ball Grid Array) reballing applications. This high-performance stencil is essential for electronics repair technicians, enabling precise alignment and accurate placement of solder balls on various chips, thus ensuring reliable repairs for smartphones, tablets, and other electronic devices.
- Material: Premium stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact and lightweight design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Designed to work with various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD9 stencil is vital for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD10
Availability: In Stock
₹160
AMAOE Stencil U-QSD10 Specifications
Product Overview
- Model: AMAOE U-QSD10
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD10 is designed for BGA (Ball Grid Array) reballing applications. This stencil is essential for electronics repair technicians, ensuring precise alignment and accurate placement of solder balls on a variety of chips, thereby facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: Premium stainless steel for enhanced durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Designed to work with a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD10 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD11
Availability: In Stock
₹160
AMAOE Stencil U-QSD11 Specifications
Product Overview
- Model: AMAOE U-QSD11
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD11 is specifically designed for BGA (Ball Grid Array) reballing applications. This stencil is crucial for electronics repair technicians, enabling precise alignment and accurate placement of solder balls on various chips, ensuring reliable repairs for smartphones, tablets, and other electronic devices.
- Material: Premium stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact and lightweight design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Designed to work with various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD11 stencil is vital for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSU1
Availability: In Stock
₹160
AMAOE Stencil U-QSU1 Specifications
Product Overview
- Model: AMAOE U-QSU1
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSU1 is designed for BGA (Ball Grid Array) reballing applications, providing a critical tool for electronics repair technicians. It enables precise alignment and accurate placement of solder balls on various chips, ensuring reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Designed to withstand temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Suitable for a wide range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSU1 stencil is essential for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSU2
Availability: In Stock
₹160
AMAOE Stencil U-QSU2 Specifications
Product Overview
- Model: AMAOE U-QSU2
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSU2 is engineered for BGA (Ball Grid Array) reballing applications, providing essential support for electronics repair technicians. This stencil ensures precise alignment and accurate placement of solder balls on various chips, guaranteeing reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Suitable for various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSU2 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSU3
Availability: In Stock
₹160
AMAOE Stencil U-QSU3 Specifications
Product Overview
- Model: AMAOE U-QSU3
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSU3 is specifically designed for BGA (Ball Grid Array) reballing applications. It is an essential tool for electronics repair technicians, ensuring precise alignment and accurate placement of solder balls on various chips, thus enabling reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Suitable for various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSU3 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSU4
Availability: In Stock
₹160
AMAOE Stencil U-QSU4 Specifications
Product Overview
- Model: AMAOE U-QSU4
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSU4 is expertly designed for BGA (Ball Grid Array) reballing applications, serving as an essential tool for electronics repair technicians. This stencil ensures precise alignment and accurate placement of solder balls on various chips, enabling reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Suitable for various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSU4 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil Mi9
Availability: In Stock
₹160
AMAOE Stencil Mi9 Specifications
Product Overview
- Model: AMAOE Mi9 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil Mi9 is specifically designed for reballing BGA chips used in the Xiaomi Mi9 series. It is an essential tool for electronics repair professionals, ensuring precise alignment and accurate placement of solder balls on chips for high-quality repair and rework tasks.
- Material: High-grade stainless steel for enhanced durability and rust resistance.
- Thickness: 0.12MM, providing precision in solder ball placement.
- Dimensions: Compact and easy to handle, designed for use in delicate electronics repair environments.
- Heat Resistance: Supports soldering operations with heat tolerance up to 500°C.
- Compatibility: Specifically tailored for Xiaomi Mi9 series BGA chips.
Included Accessories
- Optional Frame: An optional alignment frame may be included to assist in precise positioning during the reballing process.
- User Manual: Detailed instructions for usage and maintenance to ensure the best performance.
Usage
- Designed for: Electronics repair professionals focusing on Xiaomi Mi9 BGA chip reballing. The AMAOE Mi9 stencil is an essential tool for achieving accurate solder ball placement during the repair of Xiaomi Mi9 devices, ensuring efficient and high-quality repairs.
- New
Mobile Essentials: Smartphones & Accessories for Seamless Connectivity
Stay connected with our latest smartphones and mobile accessories. From chargers to cases, find everything you need for seamless communication on the go
